CMP, generally known as thermal oxidation sprucing, utilizes MP along with chemicals to improve the MRR and improve area high quality [20]. Determine 2 illustrates the schematic of a normal CMP process [21]. The SiC wafer, that's fixed on the provider, as well as the polishing pad shift relative to https://www.facebook.com/permalink.php?story_fbid=pfbid037ygWqXdnuAU2knGnKdrt92ZWnAPHZRSAgmupiwLCfW1B8btwFnCGspm3F2Pv2FsRl&id=61562415773754&__cft__[0]=AZWoUPws0hIc1ZDTeTRXteSiEfFBOaUWYI91kX8VGC79uFeq10IsV-0KASqOREUKFAQb7wd1PD2XzF0_lC-PUw-yknYcUJ15fIwYjkcdjJL4hiwyW3PqyAST0meCwIVbakD50BRbw3sc4FMaiAIdE5fkqnKuvhFLxfiMtz5z0VmhHPQHzCmwhKDm42JQUdxI2bhFzroHOQkNQ9qKFHrGULqm&__tn__=%2CO%2CP-R